Chun-Lin Tseng

Title: Innovations by Chun-Lin Tseng

Introduction

Chun-Lin Tseng is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of circuit design, holding a total of 2 patents. His work focuses on enhancing the functionality and efficiency of circuit carriers.

Latest Patents

One of Chun-Lin Tseng's latest patents involves a circuit carrier that includes a substrate, a capacitive electrode layer, a plurality of metal pads, bridges, and conductive pillars. The capacitive electrode layer is formed on a surface of the substrate and consists of multiple first and second electrodes. At least two of the first electrodes are interconnected and arranged across a die-bonding region of the substrate, which helps separate at least two of the second electrodes that partially protrude from the die-bonding region to form extensions. The metal pads and bridges are located on another surface of the substrate, outside the die-bonding region. Each bridge connects two metal pads, while each conductive pillar is embedded in the substrate, linking one of the extensions to a corresponding metal pad.

Career Highlights

Chun-Lin Tseng is currently employed at Pixart Imaging Incorporated, where he continues to innovate in the field of circuit design. His work has been instrumental in advancing the technology used in various electronic devices.

Collaborations

Chun-Lin has collaborated with talented coworkers such as Che-Chia Hsu and Yu-Han Chen, contributing to a dynamic and innovative work environment.

Conclusion

Chun-Lin Tseng's contributions to circuit design through his patents reflect his dedication to innovation in technology. His work at Pixart Imaging Incorporated continues to influence the industry positively.