Company Filing History:
Years Active: 2003
Title: Innovations of Chun-Feng Nien
Introduction
Chun-Feng Nien is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of chemical mechanical polishing (CMP). His innovative methods have the potential to enhance the manufacturing processes in the semiconductor industry.
Latest Patents
Chun-Feng Nien holds a patent for a method of reducing micro-scratches during tungsten CMP. This patent describes a process where tungsten CMP with a standard tungsten slurry is first applied to the exposed surfaces of a tungsten plug and an inter-metal dielectric (IMD) layer on a semiconductor substrate. Following this, tungsten CMP with an oxide slurry is utilized on the polished surfaces of the tungsten plugs and the IMD layer. This innovative approach aims to improve the quality and reliability of semiconductor devices.
Career Highlights
Chun-Feng Nien is associated with Silicon Integrated Systems Corporation, a company known for its advancements in integrated circuit design and manufacturing. His work at the company has been instrumental in developing new technologies that address challenges in semiconductor fabrication.
Collaborations
Chun-Feng Nien has collaborated with Shyh-Dar Lee, a fellow innovator in the field. Their partnership has contributed to the advancement of semiconductor technologies and has fostered innovation within their organization.
Conclusion
Chun-Feng Nien's contributions to the semiconductor industry through his innovative patent demonstrate his commitment to enhancing manufacturing processes. His work continues to influence the field and pave the way for future advancements in technology.