Chun-Chuan Chi

Title: Innovator Spotlight: Chun-Chuan Chi and His Contributions to 3D Stacked ICs

Introduction: Chun-Chuan Chi, hailing from Pingtung County, Taiwan, is an accomplished inventor known for his significant contributions to the field of integrated circuits. With a focus on advancing test access architectures for three-dimensional stacked integrated circuits (3D-SICs), Chi has made strides in optimizing testing processes for complex semiconductor designs.

Latest Patents: Chun-Chuan Chi holds a patent titled "Test access architecture for TSV-based 3D stacked ICS." This innovative architecture allows for both pre-bond die testing and post-bond stack testing. It employs a modular test approach enabling the testing of various dies, their embedded IP cores, inter-die TSV-based interconnects, and external I/Os as separate units. This flexibility allows for an optimized testing flow, which is crucial in the development of 3D-SICs. The architecture intelligently builds upon existing design-for-test (DfT) hardware, ensuring efficient testing at the core, die, and product levels. Access to individual die stacks is facilitated via a test structure known as a wrapper unit.

Career Highlights: Throughout his career, Chun-Chuan Chi has worked with prestigious research institutions, including Imec and Stichting Imec Nederland. His expertise in integrated circuit technology has led to innovative solutions that enhance the reliability and performance of semiconductor devices.

Collaborations: Chi has collaborated with prominent professionals in the field, such as Erik Jan Marinissen and Jacobus Verbree. These partnerships have contributed to his work's depth and breadth, enabling advancements in testing and design methodologies in integrated circuits.

Conclusion: Chun-Chuan Chi's work exemplifies the impact of innovations in the semiconductor industry. His patent on test access architecture for 3D stacked ICs highlights a significant technological advancement that is critical for future developments in integrated circuits. With a continued focus on collaboration and innovation, Chi’s contributions are sure to influence the next generation of semiconductor technology.