Company Filing History:
Years Active: 1987
Title: Christopher R Brundle: Innovator in Electroless Copper Plating
Introduction
Christopher R Brundle is a notable inventor based in San Jose, California. He has made significant contributions to the field of electroless copper plating, showcasing his expertise through innovative processes. His work has implications for various industries, particularly in electronics and manufacturing.
Latest Patents
Christopher holds a patent for a process that accelerates Pd/Sn seeds for electroless copper plating. The patent describes a method where Pd/Sn seeds are treated with an alkali metal hydroxide at a pH of about 11.3 and at a temperature above 50 degrees Celsius. This innovation enhances the efficiency of the plating process, making it more effective for industrial applications. He has 1 patent to his name.
Career Highlights
Christopher is currently employed at International Business Machines Corporation, commonly known as IBM. His role at IBM allows him to work on cutting-edge technologies and contribute to advancements in the field of materials science. His expertise in electroless copper plating is a testament to his skills and knowledge in the industry.
Collaborations
Throughout his career, Christopher has collaborated with talented individuals such as Patrick R Alnot and Daniel Jonathan Auerbach. These collaborations have fostered innovation and have led to the development of new techniques and processes in their respective fields.
Conclusion
Christopher R Brundle is a distinguished inventor whose work in electroless copper plating has made a significant impact on the industry. His innovative processes and collaborations highlight his commitment to advancing technology. His contributions continue to influence the field and inspire future innovations.