Christoph Ahamer

Title: Christoph Ahamer: Innovator in Wafer Dicing Technologies

Introduction

Christoph Ahamer is a pioneering inventor based in Villach, Austria, recognized for his significant contributions to the field of laser beam wafer dicing. With two patents to his name, Ahamer's work reflects both technical ingenuity and practical applications in semiconductor manufacturing.

Latest Patents

Ahamer's recent inventions include a cutting-edge wafer chuck designed specifically for laser beam wafer dicing equipment. This innovative chuck features a wafer support plate that contains a topographically structured surface region. This design partially or completely overlaps the edge of the wafer when placed on the dicing tape, effectively reducing the contact area between the upper surface and the dicing tape. This reduction is crucial for improving the overall efficiency and accuracy of the wireless cutting process.

In addition, he has developed a carrier tape that comprises a flexible body portion featuring multiple pockets. Each pocket includes side walls and a base bottom portion that fully surrounds a raised bottom portion of a pedestal. The structural configuration of these pockets not only enhances the functionality of the tape but also plays a vital role in the handling of semiconductor components.

Career Highlights

Christoph Ahamer is currently affiliated with Infineon Technologies AG, a leading global semiconductor manufacturer. His work at Infineon Technologies highlights his dedication to innovation within the industry, focusing on improving techniques that significantly impact manufacturing processes.

Collaborations

Throughout his career, Ahamer has collaborated with notable colleagues, including Franco Mariani and Corneleus Esguerra Caunan. These collaborations have fostered an environment of innovation and creativity, further advancing the technologies within his field.

Conclusion

Christoph Ahamer's contributions to wafer dicing technologies through his patents on innovative chuck designs and carrier tapes exemplify the spirit of modern invention. His work not only enhances manufacturing efficiency but also sets new standards in the semiconductor industry. As he continues to innovate at Infineon Technologies, his efforts will inspire future advancements in wafer processing technologies.