Stegen, Germany

Christian Wunderle


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018-2019

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2 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Inventor Christian Wunderle from Stegen, Germany**

Introduction

Christian Wunderle, an inventive mind based in Stegen, Germany, has made notable advancements in the field of electronic component cooling. With a total of two patents to his name, his work is focused on creating effective solutions for managing heat in electronic assemblies.

Latest Patents

Wunderle’s latest patent revolves around an innovative cooling device designed specifically for cooling electronic components. This cooling device features a cooling body through which a cooling medium flows, ensuring optimal temperature management. Additionally, the cooling device incorporates a cooling plate that defines a through recess in which the cooling body is partially arranged. This design not only simplifies production but also reduces manufacturing costs significantly. The device includes at least one cooling pipe in direct contact with either the cooling plate or the electronic component to transport the cooling medium effectively, absorbing heat generated by the electronic component.

Career Highlights

Currently, Christian Wunderle is contributing his expertise at Trumpf Huettinger GmbH + Co. KG. His role at the company underscores his commitment to developing innovative technologies that enhance the performance and reliability of electronic products.

Collaborations

In his professional journey, Wunderle collaborates closely with his coworker, Roland Lodholz. Together, they work on advancing technology in electronic cooling systems, pushing the boundaries of efficiency and performance.

Conclusion

Christian Wunderle's contributions to the field of electronic component cooling demonstrate the vital role of innovation in technology. With his patents and collaborative efforts, he continues to leave a significant mark on the industry, paving the way for more effective cooling solutions in electronic assemblies.

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