Lippstadt, Germany

Christian Wieck

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 3.1

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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6 patents (USPTO):Explore Patents

Title: Christian Wieck: Innovator in Adhesive Joining Methods

Introduction

Christian Wieck is a notable inventor based in Lippstadt, Germany. He has made significant contributions to the field of adhesive joining methods, holding a total of 6 patents. His innovative approaches have enhanced the efficiency and effectiveness of fastening components in various applications.

Latest Patents

Among his latest patents, Wieck has developed a method for joining a pin to a cavity and joint assembly. This method involves fastening a pin in a target position that extends partially into a cavity. The process begins by determining the distance (D) between the bottom surface of the cavity and the facing end of the pin. After positioning the pin, it is removed, and a rigid spacer is applied to the bottom surface, matching the distance (D). Adhesive is then filled into the cavity onto the rigid spacer, and the pin is repositioned. The adhesive is cured to create a strong joint between the pin and the second component. Another patent details a similar method using a flexible spacer, which also ensures a secure joint through the use of adhesive.

Career Highlights

Christian Wieck is currently employed at Hella GmbH & Co. KGaA, where he continues to innovate in the field of adhesive technologies. His work has been instrumental in developing methods that improve the reliability of component assemblies.

Collaborations

Wieck has collaborated with notable colleagues, including Ulrich Temme and Frank Passgang. Their combined expertise has contributed to advancements in adhesive joining techniques.

Conclusion

Christian Wieck's contributions to adhesive joining methods reflect his dedication to innovation in engineering. His patents demonstrate a commitment to improving the reliability and efficiency of component assembly processes.

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