Hamburg, Germany

Christian Ring

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2008-2017

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4 patents (USPTO):Explore Patents

Title: **The Innovative Mind of Christian Ring**

Introduction

Christian Ring, an accomplished inventor based in Hamburg, Germany, has made significant contributions to the field of adhesive technologies. With a remarkable portfolio of four patents, his work primarily focuses on creating advanced adhesive solutions tailored for bonding electronic components.

Latest Patents

Among his latest innovations, Christian has developed a heat-activable and crosslinkable adhesive tape designed specifically for bonding electronic components and conductor tracks. This innovative adhesive is composed of unique components that enhance its effectiveness in electronic applications. Additionally, he has crafted a method for producing crosslinked acrylate hot-melt adhesive compounds, employing a polyacrylate adhesive compound that utilizes a polyfunctional α-cleaving initiator. This initiator, present as an oligomer, is added during the hot-melt process, followed by ultraviolet crosslinking to ensure robust performance.

Career Highlights

Christian Ring has been associated with renowned companies in the adhesive industry, notably Tesa SE and Tesa Aktiengesellschaft. His expertise and innovative spirit have driven advancements in adhesive applications, making him a valuable asset in these organizations.

Collaborations

Throughout his career, Christian has collaborated with esteemed colleagues, including Thorsten Krawinkel and Ulf Cartellieri. These partnerships have fostered a creative environment, allowing for the exchange of ideas and advancements in adhesive technology.

Conclusion

Through his dedicated work and innovative spirit, Christian Ring has established himself as a prominent figure in the adhesive industry. His latest patents continue to push the boundaries of technology, ensuring that electronic components are bonded with utmost reliability and efficiency.

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