Hangzhou, China

Chonghui Sun

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Chonghui Sun

Introduction

Chonghui Sun is a notable inventor based in Hangzhou, China. He has made significant contributions to the field of wireless technology, particularly in the area of power transfer systems. His innovative work has led to the development of a unique inductive coupling system that enhances the efficiency of power transfer in advanced chip packaging.

Latest Patents

Chonghui Sun holds a patent for an "Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip package." This patent discloses a system that includes a slave chip and a master chip connected via inductive coupling. The system is designed for adaptive control of power transfer, shifting a load feedback voltage received by the slave chip into a feedback voltage data codeword through a level decision circuit. This feedback can then be loaded onto a data link and sent back to the master chip. The master chip features a DPID control circuit that adjusts the frequency of an input clock in an energy transfer system, achieving adaptive control of the transmitting power of a transmitting chip.

Career Highlights

Chonghui Sun has worked with prominent institutions, including Zhejiang University and Jcet Group Co., Ltd. His experience in these organizations has allowed him to collaborate on various innovative projects, furthering advancements in technology.

Collaborations

Chonghui Sun has collaborated with notable colleagues such as Xiaolei Zhu and Rushuo Tao. Their combined expertise has contributed to the success of their projects and innovations.

Conclusion

Chonghui Sun's contributions to the field of wireless technology and power transfer systems are commendable. His innovative patent reflects his dedication to advancing technology and improving efficiency in chip packaging.

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