Taipei, Taiwan

Chiun-Wei Chu

This inventor holds 1 USPTO granted patent. Top assignee: National Science Council of Rep. of China. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chiun-Wei Chu. Retrieved from https://idiyas.com/inventor/chiun-wei-chu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Innovations of Chiun-Wei Chu in Microelectromechanical Systems

Introduction

Chiun-Wei Chu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of microelectromechanical systems (MEMS). His innovative work focuses on improving the processes involved in the formation of cantilever structures.

Latest Patents

Chiun-Wei Chu holds a patent titled "Method of forming cantilever structure in microelectromanical system." This invention addresses a new process for creating cantilever structures in MEMS. It specifically overcomes contamination issues in undesired areas during thin-film growth. The advantages of this method include substituting complex techniques with a sacrificial layer and increasing yield due to its simple structure. This innovation also enhances the handling of sub-micron MEMS technology, particularly in the mature stage of wet-etching skills.

Career Highlights

Chiun-Wei Chu is affiliated with the National Science Council of the Republic of China. His work has been instrumental in advancing MEMS technology. He has demonstrated a commitment to research and development in this specialized field.

Collaborations

Chiun-Wei Chu has collaborated with notable colleagues, including Yean-Kuen Fang and Jyh-Jier Ho. Their joint efforts have contributed to the advancement of MEMS technologies.

Conclusion

Chiun-Wei Chu's innovative contributions to microelectromechanical systems highlight his expertise and dedication to advancing technology. His patent on cantilever structures represents a significant step forward in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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