Company Filing History:
Years Active: 2007-2010
Title: **ChinGwo Ma: Innovator in Wireless Communication Technologies**
Introduction
ChinGwo Ma is a distinguished inventor based in Taipei, Taiwan, known for his contributions to wireless communication technologies. With a total of three patents, his innovative work focuses on enhancing the efficiency of frequency offset estimation in orthogonal frequency division multiplexing (OFDM) systems.
Latest Patents
Among his latest achievements is a patent titled "Method and circuit for frequency offset estimation in frequency domain in the orthogonal frequency division multiplexing baseband receiver for IEEE 802.11a/g wireless LAN standard." This inventive method provides a systematic approach to estimating frequency offset errors. It involves calculating the phase angle of a signal field from the input signal post Fast Fourier Transformation (FFT) and channel equalization. By leveraging this phase angle, the invention estimates frequency offset errors originated from prior time-domain estimation processes, significantly improving the performance of wireless LAN standards.
Career Highlights
ChinGwo Ma is affiliated with Via Technologies, Inc., where he applies his expertise to drive innovation in the field of wireless communication. His work at the company reflects a deep commitment to advancing technology and improving communication standards.
Collaborations
Throughout his career, ChinGwo Ma has had the opportunity to collaborate with skilled professionals in his field, including notable coworkers such as Kai-Pon Kao and I-Chou Chung. These collaborations have undoubtedly enriched his work and contributed to the success of his innovative projects.
Conclusion
ChinGwo Ma’s contributions to wireless communication technologies mark him as a significant inventor in the industry. With his inventive methods aimed at improving frequency offset estimation, he continues to support advancements that enhance wireless LAN performance, showcasing the crucial role of inventors in shaping our technological landscape.