Taipei, Taiwan

Ching-Sung Tzeng


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Ching-Sung Tzeng: Innovator in Interface Technology

Introduction

Ching-Sung Tzeng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of interface technology, particularly with his innovative designs that enhance connectivity and functionality in electronic devices.

Latest Patents

One of his key patents is titled "Interface card and butterfly interface transfer structure." This invention includes a butterfly interface transfer structure that comprises an interface card, a first add-in card, and a second add-in card. The interface card features a plate with a set of electrical connecting pins, a first surface, and a second surface. The first connector is located on the first surface, while the second connector is on the second surface, both of which are electrically connected to the electrical connecting pins. A spacer is positioned between the first connector and the plate, allowing for the first add-in card to be coupled to the first connector and the second add-in card to the second connector. This innovative design streamlines the connection process and enhances the overall performance of electronic systems.

Career Highlights

Ching-Sung Tzeng is currently employed at Asustek Computer Inc., a leading company in the technology sector. His work at Asustek has allowed him to further develop his ideas and contribute to cutting-edge technology solutions.

Collaborations

Ching-Sung Tzeng collaborates with Chien-Ying Chen, a talented woman in the field. Their partnership exemplifies the importance of teamwork in driving innovation and achieving technological advancements.

Conclusion

Ching-Sung Tzeng's contributions to interface technology through his patent and work at Asustek Computer Inc. highlight his role as an influential inventor. His innovative designs continue to shape the future of electronic connectivity.

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