Company Filing History:
Years Active: 2019
Title: Chin-Yi Chuang: Innovator in Package Structure Technology
Introduction
Chin-Yi Chuang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of package structure technology, holding a patent that showcases his innovative approach to circuit design.
Latest Patents
Chuang's most recent patent is titled "Package structure and method of forming the same." This invention presents a package structure that includes a first redistribution structure and a second redistribution structure. The first redistribution structure consists of a first dielectric layer and a first redistribution circuit embedded within it. The second redistribution structure features a first portion on the first redistribution structure and a second portion on the first portion, with each portion electrically connected to the respective structures. Notably, the circuit density of the second portion is lower than that of the first portion. The first portion incorporates a second dielectric layer containing a second redistribution circuit, while the second portion includes a third dielectric layer with a third redistribution circuit. The third dielectric layer is equipped with a stiffener layer, which is separated from the third redistribution circuit by the dielectric layer. This patent reflects Chuang's expertise in enhancing circuit density and structural integrity in package design.
Career Highlights
Chin-Yi Chuang is currently employed at Nan Ya Printed Circuit Board Corporation, where he continues to innovate in the field of printed circuit board technology. His work has contributed to advancements in the efficiency and reliability of electronic packaging.
Collaborations
Chuang has collaborated with esteemed colleagues such as Guo-Shau Luo and Shing-Fun Ho. Their combined expertise has fostered a productive environment for innovation and development in their projects.
Conclusion
Chin-Yi Chuang is a prominent figure in the realm of package structure technology, with a patent that exemplifies his innovative spirit. His contributions to the field continue to influence advancements in electronic packaging.