Cambridge, MA, United States of America

Chin-Yi Cheng


Average Co-Inventor Count = 6.4

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2018-2019

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2 patents (USPTO):Explore Patents

Title: Innovations of Chin-Yi Cheng

Introduction

Chin-Yi Cheng is a notable inventor based in Cambridge, MA (US). He has made significant contributions to the field of technology, particularly in the development of innovative methods and apparatuses. With a total of two patents to his name, Cheng's work showcases his expertise and creativity in addressing complex challenges.

Latest Patents

Cheng's latest patents include "Micro-pillar methods and apparatus" and "Methods and apparatus for hygromorphic shape control." The first patent describes a digital model that efficiently represents a dense array of micro-pillars. This model allows for the fabrication of micro-pillar arrays using a 3D printer, which can actuate motion in passive objects and classify swipes through machine learning algorithms. The second patent focuses on a composite film that responds to changes in relative humidity. This film can bend in various patterns, utilizing hygromorphic materials to achieve desired transformations.

Career Highlights

Chin-Yi Cheng is affiliated with the Massachusetts Institute of Technology, where he continues to push the boundaries of innovation. His work has garnered attention for its practical applications and potential impact on various industries. Cheng's inventions reflect a deep understanding of material science and engineering principles.

Collaborations

Cheng has collaborated with notable colleagues, including Jifei Ou and Hiroshi Ishii. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Chin-Yi Cheng is a prominent inventor whose work in micro-pillar technology and hygromorphic materials demonstrates his innovative spirit. His contributions to the field continue to inspire advancements in technology and material science.

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