Chih-Nan Chen

Title: Innovations of Chih-Nan Chen in Solder Joint Technology

Introduction

Chih-Nan Chen is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of solder joint technology, particularly through his innovative methods that enhance the reliability and performance of solder joints in electronic applications.

Latest Patents

Chih-Nan Chen holds a patent for a method titled "Method for controlling beta-tin orientation in solder joints." This invention provides a technique for controlling the beta-tin crystal orientation in solder joints, which is crucial for joining metallization pads using a solder that contains tin and silver. By adjusting the silver content in the solder to a specific range of equal to or more than 2.5 wt. % and less than 3.2 wt. %, the [001] axes of beta-tin crystals can be aligned parallel to the solder/metallization pad interface. This alignment significantly reduces electromigration-induced solder deformations and metallization pad consumption, while also avoiding undesired AgSn plates in the solder matrix.

Career Highlights

Chih-Nan Chen is affiliated with Yuan Ze University, where he continues to engage in research and development in the field of materials science and engineering. His work has garnered attention for its practical applications in improving the durability and efficiency of electronic components.

Collaborations

Chih-Nan Chen has collaborated with notable colleagues, including Cheng-En Ho and Bo-Zong Chen, to further advance research in solder joint technology and related fields.

Conclusion

Chih-Nan Chen's innovative approach to controlling beta-tin orientation in solder joints represents a significant advancement in the field of electronics. His contributions not only enhance the performance of solder joints but also pave the way for future innovations in materials science.