Chih Ming Chang

Title: Innovations by Chih Ming Chang

Introduction

Chih Ming Chang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic assembly through his innovative designs and patents. His work focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

Chih Ming Chang holds a patent for a package substrate and electronic assembly. This invention includes a circuit board and a heat-dissipating element. The circuit board features a through opening designed to accommodate an electronic element. The heat-dissipating element is strategically placed on the circuit board, covering one side of the through opening. It consists of a heat-dissipating plate, an adhesive layer, and an antioxidation layer. The heat-dissipating plate has a first surface facing the through opening and a second surface opposite to it. The adhesive layer is applied to the first surface, allowing the heat-dissipating plate to adhere to the circuit board. The antioxidation layer is positioned on the second surface. Additionally, an electronic assembly that incorporates this package substrate is also part of his patent.

Career Highlights

Chih Ming Chang is associated with Mutual-Tek Industries Co., Ltd., where he continues to develop innovative solutions in the electronics sector. His work has been instrumental in advancing technologies that improve electronic assembly processes.

Collaborations

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Conclusion

Chih Ming Chang's contributions to the field of electronic assembly through his patent demonstrate his innovative spirit and commitment to advancing technology. His work continues to influence the industry positively.