Chih Feng Cheng

Title: Innovations of Chih Feng Cheng in Circuit Board Technology

Introduction

Chih Feng Cheng is a notable inventor based in New Taipei, Taiwan. He has made significant contributions to the field of circuit board technology, particularly with his innovative designs that enhance signal transmission.

Latest Patents

Chih Feng Cheng holds a patent for a circuit board assembly and cable. This invention features a circuit board and a high-speed cable that includes two signal lines, a ground conductor, an impedance-reducing conductor, and a covering material. The design ensures that the signal lines, ground conductor, and impedance-reducing conductor are integrated throughout the high-speed cable. The covering material consists of a conductive layer and an isolation layer, which work together to minimize impedance and prevent signal attenuation during high-frequency transmission.

Career Highlights

Chih Feng Cheng is currently employed at Bizlink International Corporation, where he continues to develop innovative solutions in circuit board technology. His work has been instrumental in advancing the efficiency and reliability of electronic communications.

Collaborations

Chih Feng Cheng collaborates with his coworker, Hsin Tuan Hsiao, to further enhance their projects and drive innovation within their field.

Conclusion

Chih Feng Cheng's contributions to circuit board technology exemplify the importance of innovation in enhancing electronic communication systems. His patent reflects a commitment to improving signal integrity and performance in high-speed applications.