Hsinchu, Taiwan

Chia-Yi Chuang

USPTO Granted Patents = 2 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2011-2013

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2 patents (USPTO):Explore Patents

Title: Innovations of Chia-Yi Chuang in Electromagnetic Interference Shielding

Introduction

Chia-Yi Chuang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of composites that provide electromagnetic interference (EMI) shielding. With a total of 2 patents, his work is recognized for its innovative approach to enhancing the effectiveness of polymer composites.

Latest Patents

Chia-Yi Chuang's latest patents focus on a method of preparation for a multi-walled carbon nanotube (MWCNT) and polymer composite that exhibits electromagnetic interference shielding effectiveness. The process involves dispersing MWCNTs in an organic solvent, such as N,N-Dimethylacetamide (DMAc). Monomers like methyl methacrylate (MMA) and an initiator, 2,2-azobisisobutyronitrile (AIBN), are then dissolved in the MWCNT dispersion. The mixture is polymerized at an elevated temperature, around 120°C, to form a composite that can be coated onto a PET film. This coated film can serve as an effective EMI shielding material.

Career Highlights

Chia-Yi Chuang is affiliated with Tsinghua University, where he continues to advance research in materials science. His innovative methods have the potential to impact various industries that require effective EMI shielding solutions.

Collaborations

Chia-Yi Chuang has collaborated with notable colleagues, including Chen-Chi Martin Ma and Siu-Ming Yuen. Their combined expertise contributes to the advancement of research in the field of composite materials.

Conclusion

Chia-Yi Chuang's work in developing MWCNT/polymer composites showcases his innovative spirit and dedication to enhancing electromagnetic interference shielding technologies. His contributions are paving the way for future advancements in materials science.

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