Company Filing History:
Years Active: 2017-2018
Title: Chia-Yen Wu: Innovator in Power Interconnection Technology
Introduction
Chia-Yen Wu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of power interconnection technology. With a total of 2 patents to his name, Wu's work focuses on enhancing the efficiency and safety of electrical connections.
Latest Patents
One of Wu's latest patents is titled "Power interconnection with current surge mitigation." This invention discloses an apparatus designed for power interconnection, specifically between a main connector and a DC main. The power connector features a connector power terminal, while the DC main includes a DC main power terminal. The apparatus comprises an apparatus power terminal that is electrically coupled to the DC main power terminal when connected. It also includes a first conductor with a resistor and a conductive contact, which is electrically linked to the resistor. Additionally, a second conductor is present, with the resistor connected to it. When the power connector interacts with the apparatus, the connector power terminal makes contact with the conductive contact, limiting the first current flowing through by the resistor. A receptacle structure for power interconnection is also part of this innovative design.
Career Highlights
Chia-Yen Wu is currently employed at International Business Machines Corporation (IBM), where he continues to develop cutting-edge technologies. His work at IBM has allowed him to explore various aspects of power interconnection and contribute to advancements in the field.
Collaborations
Wu collaborates with several talented individuals, including Henry T Chen and Jung-Tai Chen, who contribute to his innovative projects and research.
Conclusion
Chia-Yen Wu's contributions to power interconnection technology demonstrate his commitment to innovation and safety in electrical systems. His patents reflect a deep understanding of the challenges in this field and offer practical solutions for future advancements.