Company Filing History:
Years Active: 2002
Title: Innovations by Chia-Wen Shih
Introduction
Chia-Wen Shih is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in the design and functionality of ball grid array packages.
Latest Patents
Chia-Wen Shih holds a patent for a method aimed at reducing electrical noise inside a ball grid array package. This innovative method involves installing capacitors between multiple power pads and ground pads on the top side of the substrate. The process includes coating solder paste on the power and ground pads, applying adhesive glue beneath the capacitors, and fixing them in place. The adhesive glue is then solidified in a reflow soldering stove, enhancing the performance of the package.
Career Highlights
Chia-Wen Shih is currently employed at Silicon Integrated Systems Corporation, where he continues to develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of electronic components.
Collaborations
Chia-Wen has collaborated with talented individuals such as Cheng-Chung Cheng and Chen-Wen Tsai, who contribute to the innovative environment at their workplace.
Conclusion
Chia-Wen Shih's contributions to the field of electrical engineering, particularly through his patented method for reducing electrical noise, highlight his role as a key innovator in the industry. His work at Silicon Integrated Systems Corporation continues to influence advancements in technology.