Title: The Innovations of Chia-Ming Chang
Introduction
Chia-Ming Chang is an inventor based in Taipei, Taiwan. He has contributed to the field of electronic assembly and heat dissipation technologies. Although he currently holds no granted patents, his work reflects a commitment to innovation in his industry.
Latest Patent Applications
Chia-Ming Chang has filed several notable patent applications. One of his latest applications is for a "Heat Dissipation Assembly and Electronic Device." This disclosure provides a heat dissipation assembly that includes a first fan, a first fin assembly, a second fan, a second fin assembly, a vapor chamber, and a heat dissipation sheet. The design aims to enhance thermal management in electronic devices. Another significant application is for an "Electronic Assembly, Method for Manufacturing Electronic Assembly and Composite Thermally Conductive Sheet." This application details an electronic assembly that includes a circuit board, a heat source, an anti-overflow element, a thermally conductive block, and a thermally conductive sheet made of phase change material.
Conclusion
Chia-Ming Chang's innovative approaches in electronic assembly and heat dissipation highlight his potential as an inventor. His latest patent applications demonstrate his dedication to advancing technology in these fields.