Company Filing History:
Years Active: 2017-2018
Title: Chia-Hsien Shen: Innovator in Semiconductor Packaging
Introduction
Chia-Hsien Shen is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His innovative designs focus on enhancing the functionality and efficiency of semiconductor devices.
Latest Patents
One of his latest patents is a semiconductor package with an antenna. This design includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield, and a first mold body. The RF module features a bottom and a lateral side, with a module board at the bottom. The antenna is strategically located at the lateral side of the RF module, while the EM shield covers the RF module. The EM shield includes a side wall that is positioned between the RF module and the antenna, ensuring optimal performance. The first mold body secures the EM shield and the antenna, maintaining a predetermined distance between the antenna and the side wall of the EM shield.
Another notable patent by Chia-Hsien Shen is also a semiconductor package with an antenna. This design incorporates a substrate, multiple pin pads, an RF pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna, and conductive solder. The RF pad is utilized for receiving or transmitting RF signals on the top side of the substrate. The SMD component is mounted on the RF pad, while the mold compound covers both the semiconductor component and the SMD component. The PCB antenna is positioned on the mold compound, with the conductive solder and the SMD component stacked between the RF pad and the feeding structure of the PCB antenna.
Career Highlights
Chia-Hsien Shen is currently employed at Cyntec Company, where he continues to innovate in the semiconductor packaging industry. His work has significantly impacted the development of advanced semiconductor technologies.
Collaborations
Chia-Hsien Shen collaborates with talented individuals such as Joseph D S Deng and Shu-Wei Chang, contributing to a dynamic and innovative work environment.
Conclusion
Chia-Hsien Shen is a key figure in the semiconductor packaging field, with a focus on innovative designs that enhance device performance. His contributions through patents and collaborations continue to shape the future of semiconductor technology.