Chi-Ting Huang

Title: Innovations by Chi-Ting Huang

Introduction

Chi-Ting Huang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative work has led to the development of a unique package structure that enhances the efficiency and functionality of electronic devices.

Latest Patents

Chi-Ting Huang holds a patent for a "Package structure and manufacturing method thereof." This patent describes a package structure that includes a first chip, a first redistribution layer, a second chip, a second redistribution layer, a third redistribution layer, a carrier, and a first molding compound layer. The first redistribution layer is arranged on a surface of the first chip, while the second redistribution layer is on the second chip. The third redistribution layer interconnects the first and second redistribution layers. The carrier is positioned on the side of the third redistribution layer that is away from the first and second redistribution layers. The first molding compound layer covers the first chip, the first redistribution layer, the second chip, and the second redistribution layer. Additionally, a manufacturing method for this package structure is disclosed.

Career Highlights

Chi-Ting Huang is currently employed at Kore Semiconductor Co., Ltd. His work at this company has been instrumental in advancing semiconductor technologies. He has demonstrated a strong commitment to innovation and excellence in his field.

Collaborations

Chi-Ting Huang collaborates with talented individuals such as Ching-Yu Ni and Hsiang-Hua Lu. Their teamwork has contributed to the successful development of innovative semiconductor solutions.

Conclusion

Chi-Ting Huang's contributions to semiconductor packaging through his patent and work at Kore Semiconductor Co., Ltd. highlight his role as a key innovator in the industry. His dedication to advancing technology continues to impact the field positively.