Chi Sung Dae

Title: Innovations of Chi Sung Dae in Adhesive Tape Production

Introduction

Chi Sung Dae is a notable inventor based in Kyongki-Do, South Korea. He has made significant contributions to the field of adhesive technology, particularly in the production of adhesive tape for electronic parts. His innovative methods have enhanced the performance and reliability of electronic components.

Latest Patents

Chi Sung Dae holds a patent for a "Method of producing adhesive tape for electronic parts." This method involves creating an adhesive tape that effectively bonds electronic components, such as leads, diepads, and semiconductor chips. The tape is designed to exhibit superior adhesiveness, thermal resistance, and electrical properties. The production process includes coating a thermally resistant film with a specialized adhesive composition, which consists of various chemical components, ensuring optimal performance in electronic applications.

Career Highlights

Chi Sung Dae is associated with Saehan Industries Incorporation, where he applies his expertise in adhesive technology. His work has been instrumental in advancing the capabilities of adhesive products used in the electronics industry. His innovative approach has led to the development of high-quality adhesive solutions that meet the demands of modern electronic devices.

Collaborations

Chi Sung Dae has collaborated with notable colleagues, including Jin Hwail and Ihm Dae Woo. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge adhesive technologies.

Conclusion

Chi Sung Dae's contributions to adhesive tape production have significantly impacted the electronics industry. His innovative methods and collaborative efforts continue to drive advancements in adhesive technology, ensuring the reliability and performance of electronic components.