Chetan Sanjay Agarwal

Title: Chetan Sanjay Agarwal: Innovator in Heat Sink Technology

Introduction

Chetan Sanjay Agarwal is an accomplished inventor based in Seattle, WA. He has made significant contributions to the field of thermal management in electronics, particularly through his innovative patent related to heat sinks for multi-chip packages.

Latest Patents

Chetan holds a patent for "Heat sinks for bare die multi-chip packages." This invention discloses various mounting systems designed for attaching heat sink apparatus to bare die processors. The mounting systems feature an upper plate that includes a heat transfer portion, strategically positioned near the upper surface of bare die processors. This design facilitates effective heat conduction away from the processors. The mounting systems are engineered to secure the upper plate to the processors with balanced and centralized forces, which helps to prevent tilting and minimizes the risk of damaging the processors.

Career Highlights

Chetan is currently employed at Amazon Technologies, Inc., where he continues to innovate and contribute to advancements in technology. His work focuses on improving the efficiency and reliability of electronic components through effective thermal management solutions.

Collaborations

Chetan has collaborated with notable colleagues, including Ali Elashri and William Mark Megarity, who share his commitment to innovation and excellence in technology.

Conclusion

Chetan Sanjay Agarwal's contributions to heat sink technology exemplify his dedication to enhancing electronic performance and reliability. His innovative patent reflects his expertise and commitment to advancing the field of thermal management.