Chenyi Cui

Title: Innovations of Inventor Chenyi Cui in Flat Heat Pipe Technology

Introduction: Chenyi Cui is a distinguished inventor located in Shaanxi, China. He has made noteworthy contributions to the field of heat pipe technology, evidenced by his innovative patent. With a focus on enhancing heat exchange performance, his work reflects a deep understanding of fluid mechanics and thermal management systems.

Latest Patents: Chenyi Cui holds one patent for a "Flat heat pipe having a gradient wetting structure." This invention introduces a unique design comprising a bottom plate, a top plate, and a support plate situated between the two. The inventive aspect includes a micron-level radial strip on the inner surface of the bottom plate, along with superhydrophilic and superhydrophobic radial structures on the inner surface of the top plate. These innovations facilitate the effective transport of condensate towards the surrounding pipe wall, enhancing the directional transport of liquid and improving the heat exchange performance of the flat heat pipe.

Career Highlights: Chenyi Cui is associated with Xi'an Jiaotong University, where he contributes to advanced research in thermal technologies. His work in academia underscores his commitment to furthering the understanding and application of innovative heat transfer solutions.

Collaborations: Chenyi has collaborated with notable research professionals, including Baojin Qi and Jinjia Wei. These partnerships reflect a collaborative spirit that is vital in the field of research and innovation, enabling the development of groundbreaking technologies.

Conclusion: Chenyi Cui's contributions to the design of flat heat pipes signify important advancements in thermal management. His patent showcases not only his inventive capabilities but also the potential for practical applications in various industries. With ongoing collaborations and research efforts, Cui’s work at Xi'an Jiaotong University continues to inspire innovative approaches to heat exchange technology.