Company Filing History:
Years Active: 2025
Title: Innovations of Chengpeng Hong in Flexible Thin Film Pressure Sensors
Introduction
Chengpeng Hong is a notable inventor based in Hangzhou, China. He has made significant contributions to the field of pressure sensors, particularly in hypergravity environments. His innovative work has led to the development of advanced technologies that enhance the functionality and applicability of pressure sensors.
Latest Patents
Chengpeng Hong holds a patent for a flexible thin film pressure sensor applicable in hypergravity centrifugal environments. This invention comprises a composite thin film, two metal electrodes, and a flexible composite encapsulation layer. The composite thin film includes a polyvinylidene fluoride (PVDF) matrix with carbon nanowire filling. The design features a lower PVDF layer and an upper PVDF layer, with the two metal electrodes fixed to the surfaces of the composite thin film. A polarized region is located between the electrodes, enhancing the sensor's sensitivity. The flexible composite encapsulation layer has a double-layer structure, ensuring durability and reliability in extreme conditions. This innovative sensor design is particularly useful in applications where traditional sensors may fail.
Career Highlights
Chengpeng Hong is affiliated with Zhejiang University, where he continues to advance research in sensor technology. His work has garnered attention for its practical applications and innovative approach to solving complex engineering challenges. With a focus on enhancing sensor performance, he has established himself as a key figure in the field.
Collaborations
Chengpeng collaborates with talented individuals such as Haoran Fu and Guanwen Liang. Their combined expertise contributes to the development of cutting-edge technologies in the realm of pressure sensors.
Conclusion
Chengpeng Hong's contributions to the field of flexible thin film pressure sensors demonstrate his innovative spirit and commitment to advancing technology. His work not only enhances sensor capabilities but also opens new avenues for research and application in various industries.