Beijing, China

Chengjie Zeng


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: Chengjie Zeng: Innovator in Electronic Device Binding Technology

Introduction

Chengjie Zeng is a prominent inventor based in Beijing, China. He has made significant contributions to the field of electronic devices, particularly in the area of device binding methods. His innovative approach has led to the development of a unique patent that enhances the functionality of electronic devices.

Latest Patents

Chengjie Zeng holds a patent for an "Electronic device binding method, electronic device, mobile terminal and server." This patent discloses a method that involves receiving a binding request from a mobile terminal at an electronic device. The method includes displaying the binding request, which contains device information and user information. The electronic device then generates a binding result in response to an operator's action on the binding request and transmits this result back to the server. This innovation streamlines the process of connecting electronic devices, making it more efficient and user-friendly. He has 1 patent to his name.

Career Highlights

Chengjie Zeng is associated with BOE Technology Group Co., Ltd., a leading company in the display and sensor technology sector. His work at BOE has allowed him to focus on cutting-edge innovations that push the boundaries of electronic device capabilities.

Collaborations

Chengjie has collaborated with notable colleagues, including Jianli Yao and Yao M Wang. These partnerships have fostered a creative environment that encourages the development of advanced technologies in the electronic device industry.

Conclusion

Chengjie Zeng's contributions to electronic device binding technology exemplify his innovative spirit and dedication to enhancing user experience. His patent reflects a significant advancement in the field, showcasing the potential for future developments in electronic connectivity.

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