Cheng Yao

Title: Cheng Yao - Innovator in Electronic Device Mechanisms

Introduction

Cheng Yao is a notable inventor based in Tu-Cheng, Taiwan. He has made significant contributions to the field of electronic device mechanisms, showcasing his innovative spirit through his patented inventions.

Latest Patents

Cheng Yao holds a patent for a cover mechanism designed for electronic devices. This invention includes a base member, a cover member, and two connecting members. The cover member is movably and permanently attached to the base member, featuring a limiting assembly and defining a sliding groove. The connecting members serve to connect the cover member and the base member, with each connecting member comprising a connecting portion, a positioning end portion securely positioned on the base member, and a limiting end portion. The design allows for smooth operation, as the connecting portions are slidably received in the sliding grooves, while the limiting end portions are slidable to resist the limiting assembly. This innovative mechanism enhances the functionality and usability of electronic devices.

Career Highlights

Cheng Yao is currently employed at Chi Mei Communication Systems, Inc., where he continues to develop and refine his inventions. His work has contributed to advancements in electronic device design and functionality.

Collaborations

Cheng has collaborated with talented coworkers, including Kai-Po Chan and Chao-Kun Tseng, who have also contributed to the innovative projects at Chi Mei Communication Systems, Inc.

Conclusion

Cheng Yao's contributions to the field of electronic device mechanisms exemplify his innovative mindset and dedication to improving technology. His patent for the cover mechanism is a testament to his skills as an inventor, and his work continues to influence the industry.