Harbin, China

Cheng Wei

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Harbin Institute of Technology. Active years: 2023-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng Wei. Retrieved from https://idiyas.com/inventor/cheng-wei-njohme7l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2023-2025

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Innovations by Cheng Wei: Ground Testing Systems for Spacecraft

Introduction

Cheng Wei, based in Shenzhen, China, has made noteworthy contributions to the field of aerospace engineering through his innovative patent. His work centers around creating advanced testing systems for multi-arm spacecraft systems, demonstrating his commitment to enhancing space exploration technologies.

Latest Patents

Cheng Wei holds a patent titled "Ground test system and test method for space-oriented multi-arm spacecraft system.” This invention introduces a groundbreaking ground test system that utilizes a spacecraft system simulator, which floats on an air-floating platform supported by four porous air feet. Surrounding this simulator is a test truss, which is equipped with various components, including a simulation auxiliary docking device, a simulation crawling truss, and a satellite model. This configuration addresses significant challenges that previous technologies faced, such as the simulation of movement and assembly in a weightless environment, crucial for large space structures.

Career Highlights

Cheng Wei is affiliated with the Harbin Institute of Technology in Shenzhen, where he collaborates with leading minds in aerospace innovation. His career is marked by a dedication to advancing testing methodologies that can revolutionize how spacecraft are assessed before their deployment.

Collaborations

Throughout his career, Cheng Wei has worked alongside esteemed colleagues, including Chengfei Yue and Xibin Cao. Their teamwork has likely facilitated the exchange of ideas and has driven the development of innovative solutions for complex aerospace challenges.

Conclusion

Cheng Wei's patent symbolizes a significant advancement in the field of space technology. By addressing the challenges associated with simulating the functionality of multi-arm spacecraft systems, he is contributing to the future of space exploration and the construction of large-scale space structures. His work at the Harbin Institute of Technology in Shenzhen continues to inspire and push the boundaries of what's possible in aerospace engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…