Cheng-Wei Kuo

Title: Innovator Cheng-Wei Kuo: Advancements in Flexible Printed Circuit Board Technology

Introduction

Cheng-Wei Kuo, hailing from Taoyuan, Taiwan, is an accomplished inventor recognized for his contributions in the field of flexible printed circuit boards (FPCBs). With a strong focus on innovative materials and designs, Kuo holds one patent, signifying his dedication to advancing technology in this domain.

Latest Patents

Kuo's notable patent is for a "Stiffener sheet and flexible printed circuit board using the same." This invention pertains to a stiffener sheet that is utilized in flexible printed circuit boards and features a configuration of alternately laminated polyimide and polyamideimide layers. The molecular structure of the polyamideimide used in this invention is defined by a specific formula, incorporating various substituted aromatic groups represented by Ar and Ar', highlighting the technical complexity and innovation behind his work.

Career Highlights

Kuo is associated with Foxconn Advanced Technology Inc., a company renowned for its role in the electronics manufacturing sector. His inventive work reflects significant advancements in the usability and performance of circuit boards, which are crucial in numerous electronic applications.

Collaborations

Throughout his career, Kuo has had the opportunity to work alongside talented colleagues, including Yung-Wei Lai and Shing-Tza Liou. This collaboration underscores the importance of teamwork in driving technological advancements and fostering innovation within the research and development environment.

Conclusion

In conclusion, Cheng-Wei Kuo is a notable inventor making strides in the realm of flexible printed circuit board technology. His patented invention demonstrates a commitment to enhancing electronic components through innovative materials and designs. As Kuo continues his work at Foxconn Advanced Technology Inc., the impact of his contributions will likely resonate within the industry for years to come.