Cheng-Wei Huang

Title: Innovations by Cheng-Wei Huang in Adhesive Technologies

Introduction

Cheng-Wei Huang, an inventive mind located in Tainan, Taiwan, has made significant contributions to the field of adhesive technology. With a portfolio of 4 patents, his work particularly emphasizes the development of materials that enhance the efficiency and sustainability of shoe manufacturing.

Latest Patents

Cheng-Wei Huang's recent inventions include two notable patents that focus on innovative compositions for hot-melt adhesives and midsole materials:

1. **Composition of Hot-Melt Adhesive Film and Method for Producing Shoe Sole**: This patent describes a unique composition consisting of a hot-melt adhesive material alongside an electromagnetic radiation absorbing material. The incorporation of ethylene vinyl acetate and thermoplastic materials allows for the uniform dispersion of the absorbing material within the adhesive. By absorbing electromagnetic radiation and converting it into heat, the adhesive's bonding strength is significantly improved. Notably, the hot-melt adhesive film is designed for recyclability, aligning with modern sustainability practices.

2. **Midsole Material Composition, Method for Producing Midsole Material and Shoe Sole**: This patent outlines a new midsole material composition comprising elastomers, thermoplastic polymers, crosslinkers, and catalysts. The described production method utilizes a phase-inversion crosslinking reaction followed by a foaming process, enhancing the recycling potential of the midsole material. This advancement promotes reuse in shoe soles, providing a more sustainable approach to footwear manufacturing.

Career Highlights

Cheng-Wei Huang is affiliated with National Cheng Kung University, where he leverages his expertise in material sciences to further research and innovation in adhesive technologies. His academic background and ongoing contributions have positioned him as a prominent figure in his field.

Collaborations

Throughout his career, Cheng-Wei has collaborated with esteemed colleagues such as Chuh-Yung Chen and Chen-Chien Wang. These partnerships reflect a collaborative spirit that is vital for advancing research and bringing new inventions to fruition.

Conclusion

Cheng-Wei Huang's innovative work in hot-melt adhesive technology and sustainable materials exemplifies the impact of dedicated inventors in today's manufacturing landscape. His patents not only offer enhanced performance in shoe production but also reflect a commitment to environmental sustainability through recyclable materials. The ongoing research and collaboration at National Cheng Kung University continue to foster developments that push the boundaries of adhesive technologies.