Company Filing History:
Years Active: 2022
Title: Cheng-Lun Chu: Innovator in Chip Package Technology
Introduction: Cheng-Lun Chu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip packaging. His innovative designs have paved the way for advancements in electronic devices.
Latest Patents: Cheng-Lun Chu holds a patent for a "Chip package module including flip-chip ground pads and power pads, and wire-bonding ground pads and power pads." This patent describes a chip package module that includes a package substrate, a chip, and a conductive connector assembly. The chip is designed with a first surface and a second surface, with specific regions allocated for different functionalities. The conductive connector assembly plays a crucial role in establishing electrical connections between the chip and the package substrate.
Career Highlights: Cheng-Lun Chu is currently employed at Realtek Semiconductor Inc., a leading company in the semiconductor industry. His work at Realtek has allowed him to collaborate with other talented professionals and contribute to cutting-edge technology in chip packaging.
Collaborations: Cheng-Lun Chu has worked alongside his coworker, Sheng-Feng Chung, to further enhance the innovations in their field. Their combined expertise has led to the development of advanced semiconductor solutions.
Conclusion: Cheng-Lun Chu's contributions to chip packaging technology exemplify the spirit of innovation in the semiconductor industry. His patent and work at Realtek Semiconductor Inc. highlight his role as a key player in advancing electronic device technology.