Cheng-Chung Cheng

Title: Cheng-Chung Cheng: Innovator in Electrical Noise Reduction

Introduction

Cheng-Chung Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in the area of reducing electrical noise in electronic packages.

Latest Patents

Cheng holds a patent for a method aimed at reducing electrical noise inside a ball grid array package. This innovative method involves installing capacitors between multiple power pads and ground pads on the top side of the substrate. The process includes coating solder paste on the power and ground pads, applying adhesive glue beneath the capacitors, and fixing them in place. The adhesive glue is then solidified in a reflow soldering stove, ensuring a reliable and efficient electrical connection.

Career Highlights

Cheng-Chung Cheng is associated with Silicon Integrated Systems Corporation, where he continues to develop and refine his innovative ideas. His work has been instrumental in enhancing the performance of electronic devices by addressing critical issues related to electrical noise.

Collaborations

Cheng has collaborated with talented coworkers, including Chen-Wen Tsai and Chia-Wen Shih, contributing to a dynamic and innovative work environment.

Conclusion

Cheng-Chung Cheng's contributions to the field of electrical engineering, particularly through his patented method for reducing electrical noise, highlight his role as a key innovator in the industry. His work continues to influence advancements in electronic packaging technology.