Cheng-Chun Cheng

Title: Innovations of Cheng-Chun Cheng

Introduction

Cheng-Chun Cheng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the area of memory socket design. His innovative approach has led to the development of a unique anti-vibration and heat dissipation structure that enhances the performance and reliability of memory modules.

Latest Patents

Cheng-Chun Cheng holds a patent for an "Anti-vibration and heat dissipation structure for memory socket." This invention includes a circuit board, a heat dissipation pad, and a heat dissipation shell. The circuit board is designed with memory sockets for the insertion of memory modules. The heat dissipation pads are strategically placed on the upper and lower surfaces of the memory modules to effectively conduct heat generated by the modules. This heat is directed to the topmost heat dissipation pad through a stack structure, ensuring efficient thermal management.

Career Highlights

Cheng-Chun Cheng is currently associated with Adlink Technology Inc., where he continues to innovate and develop advanced technological solutions. His work focuses on improving the efficiency and durability of electronic components, particularly in high-performance computing environments.

Collaborations

Cheng-Chun Cheng collaborates with his coworker, Chih-Liang Fang, to further enhance their research and development efforts. Together, they aim to push the boundaries of technology and create solutions that address the challenges faced in modern computing.

Conclusion

Cheng-Chun Cheng's contributions to the field of technology, particularly through his patented innovations, demonstrate his commitment to advancing electronic design. His work not only improves the functionality of memory sockets but also sets a standard for future developments in the industry.