Chen Hua Lin

Title: Innovations of Chen Hua Lin in Moisture-Resistant Packaging

Introduction

Chen Hua Lin is an accomplished inventor based in Douliu, Taiwan. He has made significant contributions to the field of packaging technology, particularly in developing solutions for microelectromechanical systems (MEMS) devices. His innovative approach has led to the creation of a unique moisture-resistant package that enhances the reliability and performance of MEMS devices.

Latest Patents

Chen Hua Lin holds a patent for a moisture-resistant package. This invention includes an apparatus and method for creating an improved moisture-resistant package for MEMS devices that have movable parts. The package features a substrate, a translucent cover, a seal, and a moisture barrier, along with a series of parallel sidewalls that encircle the substrate and cover. These sidewalls are designed to maintain a sufficient distance between the substrate and cover, allowing for the movement of the device's parts. The package is sealed with a glue layer that fills the area between the sidewalls, ensuring that moisture cannot penetrate the package.

Career Highlights

Chen Hua Lin is currently employed at Spatial Photonics, Inc., where he continues to innovate and develop advanced packaging solutions. His work has been instrumental in improving the functionality and durability of MEMS devices, making them more effective in various applications.

Collaborations

One of his notable collaborators is Roland Van Gelder, with whom he has worked closely to advance their shared goals in packaging technology.

Conclusion

Chen Hua Lin's contributions to moisture-resistant packaging represent a significant advancement in the field of MEMS devices. His innovative solutions continue to impact the industry positively, ensuring that these devices operate reliably in various environments.