Chen-Ang Hsiao

Title: Innovations by Chen-Ang Hsiao in Cooling Systems

Introduction

Chen-Ang Hsiao is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of thermal management in electronic equipment. His innovative approach to cooling systems has led to the development of a unique patent that addresses the challenges of heat dissipation in electronic enclosures.

Latest Patents

Chen-Ang Hsiao holds a patent for a "Flat plate heat pipe cooling system for electronic equipment enclosure." This cooling system utilizes a flat plate heat pipe to efficiently transfer heat from the interior of an electronic enclosure to a removable external heat sink. The design features a metallic bottom plate with a depression containing a set of evenly spaced rods. A top plate compresses the rods, creating channels that are partially evacuated and filled with an evaporative fluid. This fluid circulates to convey heat from the warm end to the cool end of the heat pipe, ensuring effective cooling.

Career Highlights

Chen-Ang Hsiao is currently employed at Scientech Corporation, where he continues to innovate in the field of thermal management. His work has been instrumental in enhancing the performance and reliability of electronic devices through improved cooling solutions.

Collaborations

One of his notable collaborators is Hsi-Shang Li, with whom he has worked on various projects related to thermal management and cooling technologies.

Conclusion

Chen-Ang Hsiao's contributions to cooling systems exemplify the importance of innovation in the electronics industry. His patent for a flat plate heat pipe cooling system showcases his commitment to advancing technology and improving the efficiency of electronic equipment.