Location History:
- Tu-Cheng, TW (2010)
- Taipei Hsien, TW (2009 - 2011)
Company Filing History:
Years Active: 2009-2011
Title: Innovations of Che-Cheng Hu in Cooling Technologies
Introduction
Che-Cheng Hu is a notable inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of cooling technologies, particularly for electronic devices. With a total of 3 patents to his name, Hu's work focuses on innovative solutions for heat dissipation.
Latest Patents
One of Hu's latest patents is a cooling apparatus designed for dissipating heat from electronic devices. This cooling apparatus includes a casing, an impeller, and a motor. The casing absorbs heat and allows coolant to flow within it. The impeller is housed in the casing, while the motor provides the necessary force to drive the impeller, facilitating the flow of coolant. This coolant circulates between the casing and the motor to effectively remove heat.
Another significant patent is an integrated cooling system featuring multiple condensing passages for cooling electronic components. This system is designed to remove heat from heat-generating components. It consists of a base and a heat sink mounted on the base. The base has a lower portion and a higher portion that together define a space for receiving working fluid. The heat sink includes an evaporating passage and two condensing passages located on opposite sides of the evaporating passage. These passages are in fluid communication with the space, creating a loop for circulating the working fluid, which undergoes a phase change to dissipate heat.
Career Highlights
Che-Cheng Hu is currently employed at Hon Hai Precision Industry Co., Ltd., a leading company in the electronics manufacturing sector. His work at this company has allowed him to develop and refine his innovative cooling technologies.
Collaborations
Hu collaborates with Chih-Hao Yang, a fellow inventor, to further enhance their research and development efforts in cooling technologies.
Conclusion
Che-Cheng Hu's contributions to cooling technologies demonstrate his commitment to innovation in the electronics field. His patents reflect a deep understanding of heat dissipation mechanisms, which are crucial for the performance and longevity of electronic devices.