Company Filing History:
Years Active: 2008-2011
Title: The Innovations of Charles Wee Ming Lee
Introduction
Charles Wee Ming Lee is a prominent inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
One of his latest patents is titled "Semiconductor package and method for producing the same." This innovative semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip features a first face with an active surface that includes integrated circuit devices and chip contact pads. Additionally, it has a second face that lies in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip is positioned in a plane essentially perpendicular to the first and second faces. Notably, at least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.
Career Highlights
Charles Wee Ming Lee is currently employed at Infineon Technologies AG, where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise and innovative mindset have made him a valuable asset to the company.
Collaborations
Some of his notable coworkers include Kai Chong Chan and Gerald Ofner, with whom he collaborates on various projects within the semiconductor field.
Conclusion
Charles Wee Ming Lee's contributions to semiconductor technology through his patents and work at Infineon Technologies AG highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of semiconductor packaging.