Company Filing History:
Years Active: 1998
Title: **Innovator Spotlight: Charles Levern Reynolds, Jr.**
Introduction
Charles Levern Reynolds, Jr. is a notable inventor based in Red Hook, NY, recognized for his innovative contributions in the field of semiconductor technology. With a focus on enhancing the structural integrity and thermal performance of electronic components, Reynolds has made significant strides in the development of advanced packaging solutions for integrated circuits.
Latest Patents
Reynolds holds a patent for his invention titled "Structurally Reinforced Ball Grid Array Semiconductor Package and Systems." This patent describes a supporting structure for a ball grid array surface-mounted integrated circuit device composed of support solder. The invention features L-shaped patterns of high melting temperature solder positioned strategically to enhance both structural reinforcement and thermal conduction. This design ensures efficient manufacturing processes by maintaining the integrity of the solder connections between the integrated circuit and printed circuit board contacts.
Career Highlights
Charles Levern Reynolds, Jr. is currently employed at IBM, a leading company in technology and innovation. His role involves pioneering research and development efforts in semiconductor packaging, where he applies his expertise to improve electronic circuit performance and reliability.
Collaborations
Reynolds has collaborated with esteemed colleagues, including Robert Charles Dockerty and Ronald Maurice Fraga. Through these partnerships, they have explored new methods and technologies that continue to drive advancements in the field of semiconductor design and engineering.
Conclusion
Charles Levern Reynolds, Jr. exemplifies the spirit of innovation in the technology sector. His patent on structurally reinforced semiconductor packages showcases his commitment to improving electronic components' performance and durability. As a key member of IBM, Reynolds continues to push the boundaries of what is possible in semiconductor technology, shaping the future of electronic devices.