Location History:
- South Brunswick, NJ (US) (1976)
- Monmouth Junction, NJ (US) (1976 - 1988)
Company Filing History:
4 out of 456 
3 out of 824 
1 out of 2 Years Active: 1976-1988
Title: Charles E McChesney: Innovating Electronic Component Encapsulation
Introduction: Charles E McChesney, a prolific inventor hailing from Monmouth Junction, NJ, has made significant contributions to the field of electronic component encapsulation. With a total of 9 patents to his name, McChesney's work has revolutionized the way electronic components are protected and preserved.
Latest Patents: McChesney's recent patents focus on an improved thermoplastic molding composition for encapsulating electronic components. This innovative composition includes a thermotropic liquid crystalline polymer with specific properties that ensure impervious void-free encapsulation. By incorporating a particulate inorganic material, such as silicon dioxide, McChesney's composition enhances thermal conductivity and reduces the volumetric coefficient of thermal expansion, resulting in a rugged, non-burning, and cost-effective packaging solution.
Career Highlights: Throughout his career, Charles E McChesney has showcased his expertise in the field of electronic component encapsulation. Notable companies he has collaborated with include American Can Company and Celanese Gmbh. His extensive experience and dedication to innovation have led to the development of groundbreaking technologies that have reshaped the industry.
Collaborations: McChesney has had the privilege of working alongside accomplished professionals in the field, including Robert J McHenry and James A Wachtel. These collaborations have been instrumental in driving forward his inventive endeavors and fostering a culture of creativity and excellence.
Conclusion: Charles E McChesney's relentless pursuit of innovation and his commitment to excellence have established him as a leading figure in the realm of electronic component encapsulation. His patented technologies have set new standards for reliability, durability, and efficiency in the protection of electronic components, leaving a lasting impact on the industry as a whole.