Charles Divita

Title: Charles Divita: Innovator in Multi-Chip Module Assembly

Introduction

Charles Divita is a notable inventor based in Burlington, CA. He has made significant contributions to the field of electronics, particularly in the design and configuration of multi-chip module assemblies. His innovative approach has led to advancements that enhance circuit density and flexibility in electronic designs.

Latest Patents

One of Charles Divita's key patents is titled "Three dimensional packaging configuration for multi-chip module assembly." This patent describes a multi-chip module (MCM) assembly that features three stacked integrated circuit (IC) layers. The first IC layer is electrically flip-chip connected to a substrate, while the second IC layer is glued to the back of the first. The second and third IC layers are also electrically flip-chip connected to each other. This design allows for high circuit density and reduced electrical noise susceptibility, making it a significant advancement over existing MCM assemblies.

Career Highlights

Charles Divita has been associated with Gennum Corporation, where he has applied his expertise in developing innovative electronic solutions. His work has focused on creating designs that accommodate various IC sizes and technologies, providing users with high design flexibility within a single multi-chip assembly.

Collaborations

Throughout his career, Charles has collaborated with notable colleagues, including Robert E. Hawke and Atin J. Patel. These collaborations have contributed to the development of advanced technologies in the field of electronics.

Conclusion

Charles Divita's contributions to multi-chip module assembly have paved the way for more efficient and flexible electronic designs. His innovative patent and collaborative efforts highlight his significant role in advancing technology in this field.