North Royalton, OH, United States of America

Charles A Blaha


Average Co-Inventor Count = 11.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Innovator Spotlight: Charles A. Blaha and His Contributions to Microelectronics

Introduction: Charles A. Blaha is an accomplished inventor based in North Royalton, OH, whose work has significantly impacted the field of microelectronics. He is known for developing innovative solutions that enhance the performance and durability of semiconductor technology.

Latest Patents: Blaha holds a notable patent for a "Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits." This invention describes a durable bond pad structure that facilitates robust electrical connections to semiconductor microelectronics chips, particularly silicon carbide (SiC) chips. His invention enables prolonged operation of these chips even in extreme temperature ranges.

Career Highlights: Throughout his career, Charles A. Blaha has demonstrated a strong commitment to advancing technology. His patent reflects his focus on improving microelectronic components, which are crucial for modern electronics.

Collaborations: Blaha's work has seen him collaborate with esteemed colleagues, including David James Spry and Dorothy Lukco. Together, they have contributed to research and innovations that enhance the reliability and performance of electronic devices. Blaha is associated with the United States of America as represented by the Administrator of NASA, further showcasing his contributions within a prestigious organization.

Conclusion: Charles A. Blaha's innovative spirit and dedication to pushing the boundaries of technology are evident through his patent and collaborations. His work in developing a durable bond pad structure exemplifies the critical role inventors play in advancing microelectronics and ensuring the reliability of electronic devices in challenging environments.

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