Company Filing History:
Years Active: 1999-2014
Title: Chao-Chyun An: Innovator in Bonding Inspection Structures
Introduction
Chao-Chyun An is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of bonding inspection structures, holding a total of 4 patents. His innovative designs have advanced the technology used in various electronic applications.
Latest Patents
Chao-Chyun An's latest patents include a bonding inspection structure and a contact structure with a compliant bump. The bonding inspection structure features an elastic bump located on a substrate, with an opening formed in the top portion. This design allows for an inspection area that is larger than the opening, enhancing the inspection process. The contact structure incorporates a compliant bump formed on a conductive contact of a silicon wafer or printed circuit board. The core of the bump is made from polymeric material and is coated with a conductive material. This design prevents damage to the coated conductive material during probe testing, ensuring functionality is maintained.
Career Highlights
Throughout his career, Chao-Chyun An has worked with prominent organizations such as the Industrial Technology Research Institute and the Taiwan TFT LCD Association. His work in these institutions has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.
Collaborations
Chao-Chyun An has collaborated with notable colleagues, including Sheng-Shu Yang and Ming-Jong Wang. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Chao-Chyun An is a distinguished inventor whose work in bonding inspection structures has made a significant impact in the field of electronics. His innovative patents and collaborations highlight his commitment to advancing technology.