Company Filing History:
Years Active: 2025
Title: Innovations of Chao-Chin Lee
Introduction
Chao-Chin Lee is a notable inventor based in Zhunan, Taiwan. He has made significant contributions to the field of chip packaging technology. His innovative approach focuses on enhancing the efficiency of power delivery networks in chip designs.
Latest Patents
Chao-Chin Lee holds a patent for a "Chip package with integrated current control." This invention provides a chip package and method for fabricating the same, which includes a power delivery network (PDN) with non-uniform electrical conductance. The design allows for the selection of electrical conductance through each current path of the PDN, balancing the distribution of current flow across the current paths. This innovation compensates for areas of high and low current draw found in conventional designs.
Career Highlights
Chao-Chin Lee is currently employed at Xilinx, Inc., a leading company in the field of programmable logic devices. His work at Xilinx has allowed him to contribute to cutting-edge technologies that are essential for modern electronic devices.
Collaborations
Chao-Chin Lee has collaborated with talented coworkers such as Li-Sheng Weng and Chun-Yuan Cheng. Their combined expertise has fostered an environment of innovation and creativity within their projects.
Conclusion
Chao-Chin Lee's contributions to chip packaging technology exemplify the importance of innovation in the electronics industry. His patent for a chip package with integrated current control showcases his commitment to improving efficiency in electronic designs.