Company Filing History:
Years Active: 2011-2012
Title: Chanh M Vuong: Innovator in Through Substrate Via Technology
Introduction
Chanh M Vuong is a notable inventor based in Austin, TX, specializing in advanced semiconductor technologies. He holds 2 patents that contribute significantly to the field of through substrate via (TSV) technology. His work is instrumental in enhancing the performance and reliability of semiconductor devices.
Latest Patents
Chanh's latest patents focus on a method for forming a multilayered through substrate via. This innovative method involves creating an opening within a substrate and forming an adhesion layer of titanium within the via opening. A nucleation layer of titanium nitride is then formed over the adhesion layer, followed by the deposition of a tungsten layer. This tungsten layer is designed to maintain film integrity and adhesion stability by adhering to a critical film thickness. Additionally, a stress relief layer of titanium nitride is formed over the tungsten layer, with a subsequent tungsten layer deposited on top. The process includes planarizing to expose the interlevel dielectric layer and backgrinding the substrate's bottom surface to reveal the TSV's bottom portion.
Career Highlights
Chanh M Vuong is currently employed at Freescale Semiconductor, Inc., where he applies his expertise in semiconductor technology. His contributions to the company have been pivotal in advancing their product offerings and technological capabilities.
Collaborations
Chanh collaborates with Thuy B Dao, a fellow innovator in the field. Their partnership enhances the research and development efforts at Freescale Semiconductor, Inc.
Conclusion
Chanh M Vuong's innovative work in through substrate via technology showcases his commitment to advancing semiconductor technology. His patents reflect a deep understanding of the complexities involved in semiconductor manufacturing, making him a valuable asset in the industry.