Company Filing History:
Years Active: 2016
Title: Changxue Wang: Innovator in Semiconductor Manufacturing
Introduction
Changxue Wang is a notable inventor based in Potsdam, NY (US), recognized for his contributions to semiconductor manufacturing. He holds a patent that showcases his innovative approach to forming through-base wafer vias, a critical process in the production of semiconductor wafers.
Latest Patents
Changxue Wang's patent, titled "Method for forming through-base wafer vias," outlines a comprehensive method for manufacturing semiconductor wafers. This method includes several key steps: providing a semiconductor wafer with at least one electrically conductive via, affixing the front side of the wafer to a carrier, and polishing the backside of the wafer using a specialized aqueous chemical mechanical polishing composition. The process ensures that at least one electrically conductive via is exposed, enhancing the functionality of the semiconductor device. Notably, the method incorporates an additive, specifically 1,2,3-triazole, which acts as both a metal chelating agent and a metal corrosion inhibitor.
Career Highlights
Changxue Wang is currently employed at BASF SE Corporation, where he applies his expertise in semiconductor technology. His work has significantly contributed to advancements in the field, particularly in improving the efficiency and effectiveness of semiconductor manufacturing processes.
Collaborations
Throughout his career, Changxue has collaborated with esteemed colleagues, including Yuzhuo Li and Daniel Kwo-Hung Shen. These collaborations have fostered a productive environment for innovation and development in semiconductor technologies.
Conclusion
Changxue Wang's innovative methods in semiconductor manufacturing exemplify the importance of research and development in advancing technology. His contributions, particularly through his patented methods, continue to influence the industry positively.