This inventor holds 1 USPTO granted patent and 4 published patent applications and 1 EPO patent. Top assignee: Honor Device Co., Ltd.. Active years: 2024.
Company Filing History:
Years Active: 2024
Title: Changfu Huang: Innovator in Photosensitive Technology
Introduction
Changfu Huang is a notable inventor based in Dongguan, China. He has made significant contributions to the field of photosensitive technology, particularly in the development of innovative packaging structures for photosensitive chips.
Latest Patents
Changfu Huang holds a patent for a photosensitive chip package structure, which is integral to camera modules and mobile terminals. This invention includes a substrate with a photosensitive chip mounted on it. The design features a photosensitive area surrounded by a non-photosensitive area, with the chip electrically connected to the substrate via a metal wire. Additionally, the package structure incorporates a frame with an avoidance groove to protect the metal wire, ensuring durability and functionality.
Career Highlights
Changfu Huang is currently employed at Honor Device Co., Ltd., where he continues to innovate and develop advanced technologies. His work has been instrumental in enhancing the performance and reliability of mobile devices.
Collaborations
Some of his notable coworkers include Atsushi Yajima and Kun Ran, who contribute to the collaborative environment at Honor Device Co., Ltd.
Conclusion
Changfu Huang's contributions to photosensitive technology exemplify the spirit of innovation in the tech industry. His patent and ongoing work at Honor Device Co., Ltd. highlight his commitment to advancing mobile technology.