Chan Ik Park

Title: Innovations by Chan Ik Park

Introduction

Chan Ik Park is a notable inventor based in Choong-Book, South Korea. He has made significant contributions to the field of electronic packaging, particularly in the development of methods for creating assembly packages with air-tight cavities. With a total of 2 patents, his work has advanced the technology used in housing electronic elements.

Latest Patents

Chan Ik Park's latest patents include a method of making an assembly package having an air-tight cavity for housing electronic elements, such as GaAs semiconductor chips. This innovative method involves the formation of a dielectric base by placing a conductive lead frame inside a die, injecting a thermally setting liquefied epoxy, curing the epoxy, and removing the die. The design ensures that the conductive leads are held in a common level plane during the epoxy injection process, resulting in a robust assembly package that effectively houses electronic components in an air-tight environment.

Career Highlights

Throughout his career, Chan Ik Park has worked with several companies, including Communications Technology Corporation and Cti Semiconductor Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic packaging technology.

Collaborations

One of his notable coworkers is Jong Tae Kim, who has collaborated with him on various projects. Their partnership has fostered innovation and development in their field.

Conclusion

Chan Ik Park's contributions to the field of electronic packaging through his innovative methods have made a significant impact. His patents reflect a commitment to advancing technology and improving the efficiency of electronic assembly processes.