Company Filing History:
Years Active: 1986-1987
Title: The Innovations of Carl Polansky
Introduction
Carl Polansky is a notable inventor based in Landisville, PA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on methods and devices that enhance the bonding processes in semiconductor applications.
Latest Patents
One of Polansky's latest patents is a method of bonding a die to a substrate. This typical method involves placing a solder preform onto the substrate, contacting the die to the preform, and applying heat sufficient for the solder to flow and wet the substrate and die, forming a bond. The invention emphasizes heating the substrate and preform to a temperature below the melting point of the solder preform while applying pressure to reduce the thickness of the preform, ensuring adherence to the substrate before contacting the die.
Another significant patent is for a die bonder with electrically driven scrubbing means. This die bonder is designed for bonding a semiconductor die to a substrate. It features a support assembly within a frame that supports an arm, which holds the die using a vacuum collet. The variable electrical scrubbing means includes a plunger that oscillates within an electromagnetic coil, providing a uniform scrubbing action at the interface between the die and the substrate.
Career Highlights
Carl Polansky has been associated with RCA Inc., where he has contributed to various innovative projects in semiconductor technology. His expertise in bonding techniques has positioned him as a key figure in the industry.
Collaborations
Polansky has worked alongside Frank Z Hawrylo, collaborating on projects that push the boundaries of semiconductor technology.
Conclusion
Carl Polansky's contributions to the field of semiconductor technology through his innovative patents demonstrate his commitment to advancing the industry. His work continues to influence the methods used in semiconductor bonding processes.